Connectivity for Devices
Contactless solutions designed to harness the power of connected devices, including SES patented ultra-small RFID, Bluetooth, Wi-Fi, NB-IoT, and GSM technologies.
Features
- SES patented module technology
- Ultra-small UHF RFID chip connected to an antenna
- Rugged encased housing
- Showa Denko Materials patents integrated with SES IP
Applications
- Mechanical tooling
- Surgical instruments
- Industry 4.0
- Automotive parts
- Automotive production
- Sensor-enabled applications
Connectivity for Card Applications
Patented ultra-thin and ultra-flat inlay technology with high performance. Rugged antennas and standard RFID chips are engineered not to add thickness to the product or interfere with the surface quality required for premium printing.
Features
- SES patented module technology
- Wire antennas with standard RFID chips
- No module impression, supporting high-quality printing
- SES inlay thickness of approximately 200 microns; for reference, human hair is approximately 150–200 microns
- Applicable to various substrates, including PVC, biodegradable materials, and recycled PVC
Applications
- Various types of cards
- Banking cards
- ID cards and employee badges
- Public transportation tickets
- Access control cards
